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JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Option:SM-02 It can support simultaneous output

SKU: 55893607705
USD33.99 USD82.99

Pay in 4 interest-free payments of $8.50 Learn more

Shipping Estimate
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Ships within 48 hours · Estimated delivery Sep 15 - Sep 20

Description

It can support simultaneous output of two or three devices

Take apart screen cover 180℃-220℃

Check "Enable OEM unlock" option

Qualcomm QC3

6 color palettes multi-color imaging effect

JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Option:SM-02 It can support simultaneous outputJTX SM 01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8 16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement. Option: 1. SM 01: For iPhone 8 8P X Qualcomm. 2. SM 02: For

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