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XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Two ways of temperature display

SKU: 98384691748
USD25.89 USD67.89

Pay in 4 interest-free payments of $6.47 Learn more

Shipping Estimate
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Ships within 48 hours · Estimated delivery Sep 15 - Sep 20

Description

Two ways of temperature display modes (centigrade ℃

· Free ROTS Operating system

upgrade the system software through the USB

DES 560B Precision Handheld Digital Hot Air Gun De-Soldering Station

Worldwide 100-240 volt AC input voltage

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Two ways of temperature displayXZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate

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